Advancing Next-Gen AI Accelerators
Samsung and AMD Partner on HBM4 AI Memory
New MOU targets HBM4 for AMD Instinct MI455X GPUs and advanced DRAM for EPYC processors.

A close-up of a semiconductor wafer with intricate light reflections, symbolizing advanced HBM4 memory and AI chip technology.
Photo: Avantgarde News
Samsung and AMD signed a Memorandum of Understanding to collaborate on next-generation AI memory solutions [1]. The partnership focuses on supplying HBM4 chips for AMD future AI accelerators, including the upcoming Instinct MI455X GPU [1][3]. This move aims to secure high-performance components for the rapidly growing generative AI market [2]. Beyond high-bandwidth memory, the agreement includes the development of advanced DRAM for AMD EPYC server processors [1]. These technologies are critical for high-performance computing and data center efficiency [2][3]. Samsung is positioning itself as a primary supplier to compete in the high-stakes AI hardware sector [2]. This expansion strengthens the technical ties between the two semiconductor giants as they scale production [1]. The collaboration highlights the increasing demand for specialized memory capable of handling massive AI workloads [2][3]. Details regarding specific production volumes were not disclosed in the official announcement.
Editorial notes
Transparency note
Drafted with LLM; human-edited
- AI assisted
- Yes
- Human review
- Yes
- Last updated
Risk assessment
Reviewed for sourcing quality and editorial consistency.
Sources
- 1.↗
amd.com
https://www.amd.com/en/newsroom/press-releases/2026-3-18-samsung-and-amd-expand-strategic-collaboratio.html
- 2.↗
businesskorea.co.kr
https://www.businesskorea.co.kr/news/articleView.html?idxno=265533
- 3.↗
sammobile.com
https://www.sammobile.com/2026/03/18/amd-use-samsung-hbm4-chips-next-generation-ai-gpu/
Related stories
View allTopics
About the author
Avantgarde News Desk covers advancing next-gen ai accelerators and editorial analysis for Avantgarde News.


